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NC-559-ASM 100g Lead-Free Solder Flux Paste For SMT BGA Reballing Soldering
$ 5.26
- Description
- Size Guide
Description
High quality lead free solder fusing paste, free shipping, NC-559-ASM, 100g, for BGA repair solder repairModel: NC-559-ASM
Volume: 100 g/bottle
It can be used for rework, sphere or pin attachment to BGA, PGA and CSP packages, and for mounting operations such as pulling Chip attachment to PCB substrates. It is a necessary and useful tool in BGA repair.
Feature::
Excellent welding adhesion ability
Excellent anti-humidity capability
Widely used in BGA, PGA, CSP packages and flip chip operation
Suitable for multiple PCB reflux
Non-clean and lead free for environmental protection